留言板

尊敬的读者、作者、审稿人, 关于本刊的投稿、审稿、编辑和出版的任何问题, 您可以本页添加留言。我们将尽快给您答复。谢谢您的支持!

姓名
邮箱
手机号码
标题
留言内容
验证码

编委会(音序)

阅读次数:
  • 分享到:

用微信扫码二维码

分享至好友和朋友圈


Andrew Forbes, University of the Witwatersrand, South Africa
Ben Zhong TANG, South China University of Technology/The Hong Kong University of Science and Technology, China
Chongjin XIE, Alibaba Group, China
Daniel Jaque, Universidad Autónoma de Madrid, Spain
Dongling MA, National Institute of Scientific Research, Center for Energy, Materials, and Telecommunications (INRS-EMT), Canada
Dragomir Neshev, Australian National University, Australia
Eli Yablonovitch, University of California, Berkeley, USA
JingHua TENG, Institute of Materials Research and Engineering (IMRE) , Singapore
Kazuhiko Hirakawa, The University of Tokyo, Japan
Qing HU, Massachusetts Institute of Technology, USA
Qingming LUO, Hainan University, China
Qionghua WANG, Beihang University, China
Satoshi Kawata, Osaka University, Japan
Saulius Juodkazis, Swinburne University of Technology, Australia
Siddharth Ramachandran, Boston University, USA
Taco D. Visser, Vrije Universiteit Amsterdam, Netherlands
Tiejun CUI, Southeast University, China
Wolfgang Osten, Univ. of Stuttgart, Germany
Xiang LIU, HUAWEI R&D USA, China
Xiaocong YUAN, Shenzhen University, China
Xuelong LI, Northwestern Polytechnical University, China

  • 分享到:

用微信扫码二维码

分享至好友和朋友圈

阅读次数: